零间隙高密度多分片光伏组件技术白皮书TECHNICAL WHITE PAPERON ZERO-GAP HIGH-DENSITY MULTI-CUT PV MODULES联 合 发 布免责声明：本文档可能包含预测性信息，包括但不限于产品技术、性能表现等内容。由于实践中存在诸多不确定因素，实际结果可能与预测信息有所差异。因此，本文档信息仅供参考，不构成任何形式的要约或承诺。TCL中环新能源科技股份有限公司及TÜV莱茵不对您在本文档基础上做出的任何行为承担责任，亦不对文档中信息的准确性、完整性作任何明示或暗示的保证。本公司可能不经通知修改上述信息，恕不另行通知。版权所有：©2026 TCL中环新能源科技股份有限公司&TÜV莱茵.保留所有权利。未经双方书面许可，任何机构或个人不得以任何形式复制、传播或摘编本白皮书的全部或部分内容。推荐序Dear Reader,As silicon solar cell efficiencies continue to approach their practical limits, module-level innova-tion has become increasingly important in improving photovoltaic system performance, reliabili-ty, and long-term energy yield. In this context, advanced module packaging technologies play a critical role in addressing key engineering challenges, including resistive losses, thermal behavior, partial shading response, and mechanical durability.The zero-gap multi-cut module architecture presented in this white paper represents a meaningful technical approach to these challenges. By optimizing cell interconnection and module layout, the design aims to enhance power generation performance while supporting improved reliability under harsh operating conditions.TÜV Rheinland has conducted an independent technical evaluation of TCL Zhonghuan’s zero-gap multi-cut photovoltaic modules based on the test data documented in this white paper. The evalu-ation covered shading tolerance under nine defined scenarios in accordance with TÜV Rheinland internal standard 2PfG 2926 for shading resistance, hot spot endurance cycled over 30 times, UV-induced degradation under 2Pf...
